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  4. 2023
  5. VOL 45, NO 2 (2023)
  6. pp. 108-114

CREATING AND USING SOLVERS IN THE OPENFOAM PACKAGE FOR MODELING THE TEMPERATURE FIELD

I. Kuzmenko

Èlektron. model. 2023, 45(2):108-114

https://doi.org/10.15407/emodel.45.02.108

ABSTRACT

The temperature field is simulated in the OpenFOAM package using standard and created solvers. The object of research is numerical solvers of the OpenFOAM package and auxiliary utilities for calculating the temperature field. The influence of OpenFOAM package solvers on the calculation time of the temperature field is revealed, which makes it possible to create a solver with a shorter calculation time. The analysis of heat exchange was carried out by solving the problem of thermal conductivity. The created solver is written using the OpenFoam open source code in the C++ programming language in the Visual Studio Code environment. For the work of the solver on the Salome platform, a calculation grid is generated. The created solver for calculating temperatures in the OpenFOAM package requires less time for calculation.

KEYWORDS

solver, temperature field, computational mesh, OpenFOAM.

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