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  5. VOL 40, NO 2 (2018)
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  8. 34-4
  9. Modeling of Temperature Conditions in Heat-Sensitive Microelectronic Devices with Through Foreign Inclusions

Modeling of Temperature Conditions in Heat-Sensitive Microelectronic Devices with Through Foreign Inclusions

GAVRYSH V.I.

ABSTRACT

The nonlinear boundary axially symmetric problem of heat conduction for the heat-sensitive layer with through foreign cylindrical inclusion that generates heat, has been considered. With the help of the introduced function the partial linearization of the original problem has been carried out. Using the proposed piecewise-linear approximation of temperature on the boundary surface of the foreign inclusion the problem has been completely linearized. The analytical solution of this problem for finding the introduced function using Hankel integral transformation has been formed. The formulas for calculating the desired temperature have been shown and numerical analysis performed.

KEYWORDS

temperature, thermal conductivity, stationary axisymmetric problem, isotropic temperature-sensitive layer, through foreign inclusions, perfect thermal contact.

REFERENCES

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